Direct bonded copper (DBC) ceramic substrate is coated with copper metal on one or both sides of a alumina (Al2O3) or aluminum nitride (AlN) ceramic substrate.
Through the high temperature of 1065 ~ 1085 ° C environment heating, copper metal will start oxidation and diffusion with eutectic melt under ralumina (Al2O3) to form the metalized ceramic substrate; The substrate, then will be exposed with film according to the circuit design and eventually be eteched and laer scribed. The main application for DBC is power semiconductor module package, TECs and high temperature gasket.
